IMCOM 2027: 21st International Conference on Ubiquitous Information Management and Communication Taipei, Taiwan, January 4-6, 2027 |
| Conference web page | https://imcom.org/ |
| Submission link | https://easychair.org/conferences/?conf=imcom2027 |
| Poster | (download) |
| Submission deadline | September 16, 2026 |
IMCOM 2027, the Annual International Conference on Ubiquitous Information Management and Communication, is the 21st in a series of annual conferences dedicated to addressing the challenges in the areas of information management, telecommunications, and social communications.
The IMCOM conference serves as a highly selective, premier international forum addressing intelligent information processing, social network systems, wireless and wired networks, and applications. The IMCOM conference strives to provide a platform for the exchange of ideas and information, for cultivating opportunities for collaborative research, and for fostering friendship among researchers in key technology hotbeds in the Asia Pacific region engaged in various facets of information management and communications technologies appropriate for ubiquitous computing and application environments.
On behalf of the entire organizing committee, we look forward to meeting each one of you in person. See you all in Taipei, Taiwan!
Submission Guidelines
Authors are invited to submit their papers in English, presenting the results of original research or innovative practical applications relevant to the conference. Research findings can be submitted as full papers, whereas ongoing research results can be submitted as short papers, which will be presented in poster or short oral sessions. All paper submissions must be done electronically using the Easychair submission system:
- Regular papers should be from 5 to 8 pages.
- Short papers should be from 2 to 4 pages.
Note: Authors must submit a PDF version of their papers. Also, all papers must follow the IEEE proceedings format. Templates could be downloaded from below, or you can find them at the IEEE website.
Committees
General Co-Chairs
- Roslan Ismail, Universiti Kuala Lumpur, Malaysia
- Hyunseung Choo, Sungkyunkwan University, Korea
- Tei-Wei Kuo, Delta Electronics, Taiwan
Honorary General Chair
- Sukhan Lee, Sejong University, Korea
PC Co-Chair
- Dongsoo S. Kim, Purdue University, USA
- Taketoshi Ushiama, Kyushu University, Japan
- Duc-Tai Le, Sungkyunkwan University, Korea
Advisory Co-Chair
- Mir Feroskhan, Nanyang Technological University, Singapore
- Adrian Stoica, NASA Jet Propulsion Laboratory, USA
- Sajal K. Das, Missouri University of Science and Technology, Rolla, USA
- Zalizah Awang Long, Universiti Kuala Lumpur, Malaysia
- Toyohide Watanabe, Nagoya Industrial Science Research Institute, Japan
- Mozafar Saadat, University of Birmingham, United Kingdom
- Saeid Nahavandi, Swinburne University of Technology, Australia
- Susanto Rahardja, Northwestern Polytechnical University, China
- Jin Hyung Kim, AIRI, Korea
- Yoshifumi Masunaga, Ochanomizu University, Japan
- Mehrdad Saif, University of Windsor, Canada
Partner University Co-Chair
- Xiaofeng Gao, Shanghai Jiao Tong University, China
- Mohd Nizam Husen, Universiti Kuala Lumpur, Malaysia
- Jun Feng, Hohai University, China
Contact
All questions about submissions should be emailed to imcom.skku@gmail.com
