STISWB2026: The 18th International Conference on Science, Technology and Innovation for Sustainable Well-Being Tsukuba International Congress Center, Tsukuba, Japan Ibaraki & Tokyo, Japan, June 14-17, 2026

About STISWB2026

The 18th International Conference on Science, Technology and Innovation for Sustainable Well-Being (STISWB2026) is one of the major international academic conferences organized by the Heat Pipe and Heat System Association. The conference brings together researchers, engineers, academics, and practitioners working across the fields of engineering, science, and technology.

This international conference provides a platform for presenting and discussing state-of-the-art research, technological developments, and innovative practices. It also promotes interdisciplinary collaboration among participants from various sectors, including education and related fields. By integrating diverse knowledge and perspectives, STISWB2026 aims to advance science, technology, and innovation toward practical applications that contribute to sustainable well-being for society and humankind.

Conference Venue

• Tsukuba International Congress Center, Tsukuba, Japan
• Address: 2-20-3 Takezono, Tsukuba City, Ibaraki Prefecture 305-0032, Japan
• Phone number: +81 29-861-0001
• Website: https://www.epochal.or.jp/en/
• GPS Coordinates: 36.07609065013597, 140.11709291534257

Important Dates

• Deadline for Full Paper Submission: 1 February 2026

• Acceptance Notification: 1 April 2026

• Deadline for Final Papers: 15 April 2026

• Registration Deadline: 1 May 2026

• Conference Dates: 14-17 June 2026

List of Topics

• Topic 1 Energy Technology and Management (ETM)
• Topic 2 Civil Engineering and Management (CVE)
• Topic 3 Mechanical Engineering (MEE)
• Topic 4 Electrical, Electronics and Mechatronics Engineering (EEM)
• Topic 5 Agricultural, Biological and Food Engineering (ABE)
• Topic 6 Chemical and Petroleum Engineering (CPE)
• Topic 7 Materials Engineering (MTE)
• Topic 8 Environmental Engineering and Management (EVE)
• Topic 9 Industrial and Manufacturing Engineering (IME)
• Topic 10 Automotive Engineering (ATE)
• Topic 11 Computer and Software Engineering (CSE)
• Topic 12 Transport Engineering (TSE)
• Topic 13 Engineering Business Management (EBM)
• Topic 14 Applied Science and Innovation (APS)
• Topic 15 Innovation and Technology (ITS)

Committees

International Organization Committee

1. Prof. Hirotaka Nakai, Inter-University Research Institute Corporation High Energy Accelerator Research Organization, Japan
2. Prof. Peng Zhang, Shanghai Jiao Tong University, China
3. Asst. Prof. J.W. Lou, Tsinghua University, Beijing, China
4. Prof. Dr. Aliakbar Akbarzadeh, Mechanical and Manufacturing Engineering, RMIT University, Australia
5. Prof. Dr. Masahide Murakami, University of Tsukuba, Japan
6. Assoc. Prof. Dr. Kimura Nobuhiro, Cryogenics Science Center/KEK, Japan
7. Prof. Pradit Terdtoon, Chiang Mai University, Thailand
8. Assoc. Prof. Dr. Nitipong Soponpongpipat, Heat Pipe and Heat Systems Association

STISWB Local Organization Committee

1. Assoc. Prof. Dr. Piyanan Charoensawan, Heat Pipe and Heat System Association
2. Dr. Thanad Katpraidt, Heat Pipe and Heat System Association
3. Asst. Prof. Dr. Nattawut Tharawadee, Heat Pipe and Heat System Association
4. Asst. Prof. Dr. Weeranut Intagun, Heat Pipe and Heat System Association
5. Dr. Thanad Katpraidt, Heat Pipe and Heat System Association
6. Dr. Nat Thuchayapong, Heat Pipe and Heat System Association
7. Dr. Paisan Comsawang, Heat Pipe and Heat System Association
8. Dr. Nattarat Chutwiboonkun, Heat Pipe and Heat System Association

For Authors

Please carefully follow the guidelines below when preparing your manuscript and making a submission.

1. Paper Template. Download the official conference paper template:

• Download Template (.docx)

• Download Template (PDF)

2. Submission Guide. Instructions for manuscript preparation and submission process:

• Download Submission Guide (PDF)

3. Suggested Reviewers Form. Authors must provide 3 suggested reviewers during submission:

• Fill out the Suggested Reviewers Form (Google Form)

More information

• More information will be announced soon.