You are cordially invited to participate in the first workshop on Software Engineering in Industry 4.0 Ecosystems (SEI4E) co-located with the 7th International Conference on Emerging Data and Industry (EDI40). In this workshop, we'll delve into the challenges posed by inter-dependent software components, including: firmware, operating systems, libraries, programming languages, databases, frameworks, browsers. We'll explore on how to ensuring robust and working software systems in Industry 4.0. This workshop aims to address these challenges and foster collaborative problem-solving within the software engineering community. The workshop provides a platform for researchers and industry experts to exchange ideas, present their work, and discuss innovations in this field, including topics, such as:

• Software Engineering and Industry 4.0 Ecosystem Requirements
• Software Engineering and Industry 4.0 Ecosystem Architectural Constraints>
• Software Engineering and Industry 4.0 Ecosystem Security Constraints
• Software Engineering and Industry 4.0 Ecosystem Testing and Verification
• Software Engineering and Industry 4.0 Ecosystem Dependencies, Updates, and Release Cycles
• Software Engineering and AI Aided Industry 4.0 Ecosystem

Submission Guidelines

We welcome contributions in the form of short papers.

Important Information

• Workshop Date: April 2024
• Location: Hasselt, Belgium
• Conference: The 7th International Conference on Emerging Data and Industry (EDI40)
• Conference registration here

Submission Requirements

• Paper should be no more than 6 pages in length.
• Submission due date: January 19th, 2024
• Author Notification: January 31th, 2024
• Camera-ready due date: February 9th, 2024

Prospective authors are invited to submit original and unpublished papers. Papers should be submitted in PDF following the format the guidelines of Procedia Computer Science, MS Word Template, LaTeX, Template Generic, and have no more than 6 pages, including all figures and references.

Committees

Program Committee

• Sotiris Kentros, Salem State University, USA
• Foutse Khomh, Polytechnique Montreal, Canada
• John Businge, University of Nevada, Las Vegas, USA
• Rishabh Mankatala, Boeing, USA

Organizing committee

• Solomon Berhe, University of the Pacific
• Tapadhir Das, University of the Pacific

Contact

All questions about submissions should be emailed to: sei40e@gmail.com